ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,608, issued on Oct. 28, was assigned to DISCO Corp. (Tokyo).
"Method of processing wafer" was invented by Yu Zhao (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer has a substrate and a functional layer disposed on the substrate along a plurality of projected dicing lines. A method of processing the wafer includes applying a laser beam to the wafer along the projected dicing lines to remove portions of the functional layer, forming processed grooves in the functional layer through which the substrate is exposed, removing damaged regions produced in an interface between the substrate and the functional layer by the laser beam, and forming...