ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,454,077, issued on Oct. 28, was assigned to DISCO Corp. (Tokyo).
"Dividing apparatus" was invented by Shinya Aruga (Tokyo) and Hiroaki Kobayashi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A dividing apparatus is provided with a second camera that forms a second image to be used for determining whether or not a wafer is divided at a first projected dicing line. That is, in the dividing apparatus, whether or not the wafer is divided at the first projected dicing line can be checked in reference to the second image. Hence, in the dividing apparatus, even in a case where part of the wafer remains at the first projected dicing line and the wafer i...