ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,365, issued on Oct. 21, was assigned to DISCO Corp. (Tokyo).
"Package device manufacturing method" was invented by Kyosuke Kobinata (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package device manufacturing method is provided. In the manufacturing method, device chips are disposed on first regions of a workpiece, and a mold resin is supplied to second regions higher than the first regions and the first regions. Further, the mold resin is processed and thinned to a thickness with which the second regions of the workpiece are not exposed, and the mold resin is polished to expose the second regions of the workpiece and form, in the workpiece,...