ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,708, issued on Nov. 25, was assigned to DISCO Corp. (Tokyo).
"Wafer processing method" was invented by Tsubasa Hirose (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer processing method includes a shield tunnel forming step of executing irradiation with a laser beam with a wavelength having transmissibility with respect to a wafer to form shield tunnels each including a fine pore and a modified tube that surrounds the fine pore, and a dividing step of applying an external force to the wafer to divide the wafer into individual device chips. The shield tunnel forming step includes a first shield tunnel forming step of successively forming ...