US Patent Issued to DISCO on Nov. 25 for "Wafer processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,048, issued on Nov. 25, was assigned to DISCO Corp. (Tokyo).

"Wafer processing apparatus" was invented by Kentaro Iizuka (Tokyo), Kazuya Hirata (Tokyo), Hayato Iga (Tokyo), Hironobu Ozawa (Tokyo), Mato Hattori (Tokyo) and Hideo Iwata (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A processing apparatus includes a chuck table for holding a bonded wafer thereon, a grinding unit for grinding the bonded wafer, a cleaning unit for cleaning the bonded wafer, and a processing unit for removing a beveled portion of an outer circumferential end portion of the bonded wafer before the grinding unit grinds the bonded wafer. The processing unit includes a...