ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,148, issued on Nov. 18, was assigned to DISCO Corp. (Tokyo).
"Method of processing wafer" was invented by Yukinobu Ohura (Tokyo) and Senichi Ryo (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of processing a wafer having a plurality of devices provided in respective areas demarcated on a face side of the wafer by a plurality of projected dicing lines. The method includes coating the face side with a protective film agent and thereafter drying the protective film agent into a protective film covering the face side, applying a laser beam having a wavelength absorbable by the wafer to the wafer along the projected dicing lines on the fa...