US Patent Issued to DISCO on Nov. 18 for "Method of processing a substrate and system for processing a substrate" (Japanese, German Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,581, issued on Nov. 18, was assigned to DISCO Corp. (Tokyo).

"Method of processing a substrate and system for processing a substrate" was invented by Karl Heinz Priewasser (Munich) and Naoko Yamamoto (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate having a first side and a second side opposite to the first side is processed by attaching a protective film to the first side and, after attachment, processing the substrate from the second side of the substrate. After processing from the second side, the second side is inspected for defects on the second side of the substrate. After inspection for defects, a support film is attached to ...