ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,474,217, issued on Nov. 18, was assigned to DISCO Corp. (Tokyo).
"Inspection method" was invented by Teppei Nomura (Tokyo), Zhiwen Chen (Tokyo) and Youngsuk Kim (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "An inspection method includes applying a laser beam to a semiconductor chip to reflow a bump disposed on a surface of the semiconductor chip and included in an irradiation range of the workpiece, the laser beam being applied from an opposite surface of the semiconductor chip, capturing an image of the irradiation range with use of a thermal camera while the laser beam is applied to the semiconductor chip, and acquiring temperature information...