US Patent Issued to DISCO on May 6 for "Diamond wafer dividing method and chip manufacturing method" (Japanese Inventor)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,915, issued on May 6, was assigned to DISCO Corp. (Tokyo).

"Diamond wafer dividing method and chip manufacturing method" was invented by Yoshiaki Shimizu (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a diamond wafer dividing method used when the diamond wafer having a front surface along the {100} plane is divided at planned dividing lines along the greater than110less than direction. The dividing method includes a first modified layer forming step of forming a first modified layer at a linear first region along the planned dividing line, inside the diamond wafer, a second modified layer forming step of forming a second mod...