ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,276, issued on May 20, was assigned to DISCO Corp. (Tokyo).
"Tape pressure bonding apparatus" was invented by Takashi Uchiho (Tokyo), Yoshinobu Saito (Tokyo) and Yoshinori Kakinuma (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A tape pressure bonding apparatus includes an upper chamber, a lower chamber, a lifting mechanism that switches between a closed state in which the upper chamber is moved downward to be brought into contact with the lower chamber and an open state in which the upper chamber is separated from the lower chamber, a vacuum section that evacuates the upper chamber and the lower chamber, and an atmosphere opening section tha...