ALEXANDRIA, Va., June 16 -- United States Patent no. 12,304,024, issued on May 20, was assigned to DISCO Corp. (Tokyo).
"Polishing tool" was invented by Naruto Fuwa (Tokyo) and Naoya Sukegawa (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a polishing tool for polishing a wafer. The polishing tool includes a base and a polishing layer fixed to the base. The polishing layer includes an electrically conductive material dispersed therein to eliminate static electricity generated when the polishing layer comes into contact with the wafer. Preferably, the electrically conductive material is carbon fiber, and the carbon fiber is included at a content of 3 wt % or more but 15 wt % or less."...