ALEXANDRIA, Va., June 16 -- United States Patent no. 12,304,110, issued on May 20, was assigned to DISCO Corp. (Tokyo).
"Peeling method and peeling apparatus" was invented by Ryohei Yamamoto (Tokyo), Koyo Honoki (Tokyo) and Koji Itabashi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "An ultrasonic wave is applied to an upper surface of an ingot via a liquid layer, in a state in which an outer circumferential region of a lower surface of the ingot is sucked. A lower side around an outer circumferential arc-shaped portion of the lower surface of the ingot is open so that liquid that serves as a medium of the ultrasonic wave does not collect around the outer circumferential arc-shaped portion of the lowe...