ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,293, issued on May 20, was assigned to DISCO Corp. (Tokyo).
"Method of processing wafer" was invented by Masaru Nakamura (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of processing a wafer having a plurality of devices formed in respective areas on a face side of the wafer, the areas being demarcated by a plurality of intersecting projected dicing lines, includes a resin applying step of coating the face side of the wafer with a liquid resin to cover an area of the wafer where the plurality of devices are present, a resin curing step of curing the liquid resin into a protective film, a protective tape laying step of laying a protect...