US Patent Issued to DISCO on May 20 for "Grinding apparatus and use method of grinding apparatus" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,304,027, issued on May 20, was assigned to DISCO Corp. (Tokyo).

"Grinding apparatus and use method of grinding apparatus" was invented by Tomotaka Tabuchi (Tokyo), Yuannan Li (Tokyo) and Kazuma Sekiya (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A grinding apparatus includes a first chuck table that has a porous holding surface corresponding to a first wafer and holds the first wafer, a second chuck table that has a porous holding surface corresponding to a second wafer different from the first wafer in size or shape and holds the second wafer, and a grinding unit that grinds, by a grinding wheel, the first wafer sucked and held by the first ch...