US Patent Issued to DISCO on May 13 for "Wafer manufacturing method and laminated device chip manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,545, issued on May 13, was assigned to DISCO Corp. (Tokyo).

"Wafer manufacturing method and laminated device chip manufacturing method" was invented by Youngsuk Kim (Tokyo), Byeongdeck Jang (Tokyo), Akihito Kawai (Tokyo) and Shunsuke Teranishi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer manufacturing method includes a wafer preparing step of preparing a wafer including a semiconductor device formed in each of a plurality of regions demarcated by a plurality of streets intersecting each other, a removing step of removing, from the wafer, a defective device region including a semiconductor device determined to be a defective product ...