ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,546, issued on May 13, was assigned to DISCO Corp. (Tokyo).
"Wafer dividing method" was invented by Namsun Choi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer dividing method of dividing a wafer along each of a plurality of projected dicing lines set in a grid pattern on a front surface of the wafer includes forming a division initiating point serving as an initiating point of division of the wafer along each of the dicing lines, adhering a protective film made of an olefin-based resin and having one surface with no adhesive used therein to the wafer in such a manner that the one surface is brought into intimate contact with the front...