ALEXANDRIA, Va., June 12 -- United States Patent no. 12,296,502, issued on May 13, was assigned to DISCO Corp. (Tokyo).
"Peeling apparatus" was invented by Koyo Honoki (Tokyo) and Ryohei Yamamoto (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a peeling apparatus including an ingot holding unit that has a holding surface for holding an ingot, a wafer holding unit that is capable of approaching and separating from the ingot holding unit and has a holding surface for holding under suction a wafer to be produced, and a cleaning brush that cleans peel-off surfaces at which the wafer to be produced has been peeled off from the ingot and thereby removes peeling swarf."
The patent was filed...