ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,086, issued on March 18, was assigned to DISCO Corp. (Tokyo).
"Processing method of wafer" was invented by Kohei Tsujimoto (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer processing method includes sticking an adhesive tape to the front surface of a wafer, disposing a thermocompression bonding sheet on the adhesive tape stuck to the front surface of the wafer. The thermocompression bonding sheet is heated and pressed by a flat member to execute pressure bonding of the thermocompression bonding sheet to the adhesive tape and integrate the thermocompression bonding sheet with the wafer. The processing method also includes holding the si...