ALEXANDRIA, Va., March 19 -- United States Patent no. 12,251,768, issued on March 18, was assigned to DISCO Corp. (Tokyo).
"Cutting apparatus" was invented by Takashi Fukazawa (Tokyo) and Satoshi Sawaki (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A cutting apparatus for cutting a workpiece includes a chuck table having a holding surface for holding the workpiece thereon, a cutting unit having a spindle with a cutting blade mounted on a distal end thereof for cutting the workpiece held on the holding surface, an image capturing unit for capturing an image of an outer circumferential portion of the cutting blade mounted on the cutting unit, and a determining section for determining the orientation of...