US Patent Issued to DISCO on June 24 for "Method of manufacturing chips" (Japanese Inventor)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,068, issued on June 24, was assigned to DISCO Corp. (Tokyo).

"Method of manufacturing chips" was invented by Hideyuki Sandoh (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An outer circumferential region of a metal film and a portion of an outer circumferential region of a substrate on a reverse side thereof are removed, thereby exposing the outer circumferential region of the substrate and creating on a reverse side of an outer circumferential region of the wafer an exposed surface where a portion closer to a face side of a wafer is located outwardly of a portion remoter from the face side of the wafer. When a tape is affixed to a reverse si...