ALEXANDRIA, Va., June 19 -- United States Patent no. 12,330,266, issued on June 17, was assigned to DISCO Corp. (Tokyo).
"Polishing apparatus with thickness measuring unit" was invented by Kazuma Sekiya (Tokyo) and Keiji Nomaru (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing apparatus includes a polishing unit that rotatably supports a polishing pad for polishing a wafer held on a holding surface of a chuck table and that has a spindle formed with a through-hole extending from one end of the spindle to the other end of the spindle in an axis of the spindle. A thickness measuring unit is disposed at one end of the through-hole of the spindle that measures a thickness of the wafer. A controll...