US Patent Issued to DISCO on July 8 for "Laminated device chip manufacturing method" (Japanese Inventor)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,995, issued on July 8, was assigned to DISCO Corp. (Tokyo).

"Laminated device chip manufacturing method" was invented by Shunsuke Teranishi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A laminated device chip manufacturing method includes: a first wafer processing step of exposing a first resin layer disposed in first grooves to an undersurface side of a first wafer by thinning the first wafer fixed to a first support; a laminating step of laminating the undersurface side of the first wafer and a top surface side of a second wafer to each other such that the first resin layer exposed to the undersurface side of the first wafer and a second r...