ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,535, issued on July 29, was assigned to DISCO Corp. (Tokyo).
"Wafer processing apparatus and wafer processing method" was invented by Kazuma Sekiya (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer processing apparatus includes a holder which holds a wafer by sandwiching an outer circumferential surplus region of the wafer between a face side and a reverse side thereof, a vacuum chamber which houses the holder therein such that the wafer held by the holder defines an upper compartment and a lower compartment in the vacuum chamber, an evacuating unit which evacuates the upper compartment and the lower compartment and developing a positive...