US Patent Issued to DISCO on July 29 for "Package substrate, package substrate processing method, and packaged chip" (Japanese Inventor)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,607, issued on July 29, was assigned to DISCO Corp. (Tokyo).

"Package substrate, package substrate processing method, and packaged chip" was invented by Naotaka Oshima (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package substrate includes a metallic lead frame that includes first frame portions in a lattice shape along planned dividing lines and a plurality of first electrode portions extending from each of the first frame portions, a connection frame that includes second frame portions in a lattice shape along the planned dividing lines and a plurality of second electrode portions extending from each of the second frame portions, the co...