ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,587, issued on July 29, was assigned to DISCO Corp. (Tokyo).
"Method of processing workpiece" was invented by Jinyan Zhao (Tokyo) and Yihui Lee (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of processing a warped workpiece includes a warpage eliminating step of applying a laser beam whose wavelength is transmittable through the workpiece to the workpiece while positioning a focused spot of the laser beam in the workpiece at a predetermined first position thicknesswise across the workpiece, thereby forming modified layers in the workpiece and cracks extending from the modified layers to a lower surface of the workpiece along all of p...