ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,731, issued on Jan. 28, was assigned to DISCO Corp. (Tokyo).
"Wafer processing method" was invented by Kazuma Sekiya (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer processing method includes a wafer accommodating step of accommodating a wafer in a vacuum chamber, a protective sheet disposing step of disposing a protective sheet on a front surface of the wafer, a decompression step of decompressing the inside of the vacuum chamber, after the wafer accommodating step and the protective sheet disposing step, a press-fitting step of pressing the protective sheet against a peripheral marginal area of the wafer in the vacuum chamber to pres...