ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,732, issued on Jan. 28, was assigned to DISCO Corp. (Tokyo).
"Method of transferring wafer" was invented by Yoshinori Kakinuma (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein is a method of transferring a wafer from a first tape that has been pressure-bonded to one surface of the wafer and also to a first frame having an opening with the wafer positioned therein, to a second tape that has been pressure-bonded to a second frame. The method includes a first-frame removing step of detaching the first tape from the first frame by pressing a portion of the first tape that lies between the first frame and the wafer, a second-frame p...