ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,685, issued on Jan. 20, was assigned to DISCO Corp. (Tokyo).
"Method of processing wafer and laser applying apparatus" was invented by Keiji Nomaru (Tokyo), Nobuyuki Kimura (Tokyo) and Kentaro Odanaka (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A laser applying apparatus includes a beam spot shaper for shaping a spot of a laser beam into a slender spot and orienting the polarization direction of a linearly polarized laser beam of the laser beam along a longer side of the slender spot, and a spot control unit for positioning a P-polarized laser beam on slanted surfaces of a recess that is formed in a wafer by orienting the longer side of th...