US Patent Issued to DISCO on Jan. 13 for "Wafer processing method and device chip manufacturing method" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,527,067, issued on Jan. 13, was assigned to DISCO Corp. (Tokyo).

"Wafer processing method and device chip manufacturing method" was invented by Kazuma Sekiya (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer processing method for processing a wafer having a plurality of devices formed on a first surface thereof includes positioning a first focal point of a first laser beam at a first height and emitting the first laser beam onto the wafer from a side on which a second surface lies, thereby forming a protective layer, positioning a second focal point of a second laser beam at a second height being more distant from the first surface than the ...