ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,522,522, issued on Jan. 13, was assigned to DISCO Corp. (Tokyo).
"Processing wafer regeneration equipment" was invented by Yoshinobu Saito (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Processing water regeneration equipment includes a waste liquid treatment apparatus that treats waste liquid discharged from a processing apparatus for processing a workpiece by use of processing water, and a fuel cell apparatus that causes a chemical reaction between hydrogen and oxygen to produce electricity and water. The waste liquid treatment apparatus includes a positive electrode and a negative electrode disposed in a tank for reserving the waste liquid, an...