ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,314, issued on Dec. 30, was assigned to DISCO Corp. (Tokyo).
"Processing method of wafer" was invented by Shunsuke Teranishi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "In a processing method of a wafer having a front surface and a back surface on a side opposite to the front surface, a support substrate having a support surface that supports the wafer is provided, a hydrophilic treatment is performed on at least one of the front surface of the wafer or the support surface of the support substrate, the front surface of the wafer and the support surface of the support substrate are brought to face each other and are joined together to form ...