ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,383,982, issued on Aug. 12, was assigned to DISCO Corp. (Tokyo).
"Laminated device wafer forming method" was invented by Zhiwen Chen (Tokyo), Kyosuke Kobinata (Tokyo), Shunsuke Teranishi (Tokyo) and Akihito Kawai (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A laminated device wafer forming method includes a laminating step of laminating a first device wafer and a second device wafer to each other, the laminating step including a position adjusting step of imaging, by an imaging unit, a first predetermined line formed on a peripheral portion on the front surface side of the first device wafer and located outside rectangular regions corresponding...