ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,682, issued on April 29, was assigned to DISCO Corp. (Tokyo).
"Processing method of wafer" was invented by Youngsuk Kim (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Energy is locally supplied to a cutting surface that is formed in an outer circumferential region of a wafer in a trimming step, before a grinding step of grinding the wafer. This can remove or repair at least part of a damage layer formed in the outer circumferential region of the wafer due to the trimming step. As a result, breakage of the wafer that originates from the outer circumferential region in the grinding of the wafer which has been subjected to the edge trimming and g...