US Patent Issued to Diodes on March 25 for "Semiconductor structures and manufacturing methods thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,046, issued on March 25, was assigned to Diodes Inc. (Plano, Texas).

"Semiconductor structures and manufacturing methods thereof" was invented by Jie Li (New Taipei, Taiwan), Ming-Wei Tsai (New Taipei, Taiwan), Chiao-Shun Chuang (New Taipei, Taiwan) and Ching-Wen Wang (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various methods for manufacturing semiconductor structures are provided. An embodiment method includes forming a first patterned hard mask and epitaxial layer on a semiconductor substrate, and forming a first doped region in the epitaxial layer by performing a first implantation through the first patterned hard mask. A...