US Patent Issued to DIC on May 6 for "Conductive pillar, method for manufacturing the same, and method for manufacturing bonded structure" (Japanese Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,983, issued on May 6, was assigned to DIC Corp. (Tokyo).

"Conductive pillar, method for manufacturing the same, and method for manufacturing bonded structure" was invented by Ryota Yamaguchi (Sakura, Japan) and Makoto Yada (Sakura, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method for manufacturing a conductive pillar capable of bonding a substrate and a bonding member with high bonding strength via a bonding layer without employing an electroplating method, and a method for manufacturing a bonded structure by employing this method. A method for manufacturing a conductive pillar 1 includes, in sequence, the steps of forming a...