ALEXANDRIA, Va., June 16 -- United States Patent no. 12,305,094, issued on May 20, was assigned to DIC Corp. (Tokyo).
"Pressure-sensitive adhesive tape" was invented by Daisuke Watanabe (Saitama, Japan), Kota Suetsugu (Saitama, Japan) and Akira Yamakami (Saitama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An adhesive tape has adhesive strength with high high-load holding power, temporal repeelability, and storage stability. The adhesive tape includes a substrate layer and an adhesive layer. The substrate layer has a breaking stress in a range of 1 to 100 MPa and an elongation at break in a range of 300% to 3000%. The adhesive layer contains a tackifier resin and a triblock copolymer with a repeatin...