ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,378,454, issued on Aug. 5, was assigned to DIC Corp. (Tokyo).
"Adhesive, laminate, and packaging material" was invented by Hiroshi Ebato (Tokyo), Yutaka Hamasuna (Tokyo) and Takashi Mihara (Chiba, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a laminating adhesive, a laminate, and a packaging material which are excellent in retorting resistance and content resistance. The adhesive includes a polyol composition (A) including a polyester polyol (A1), and a polyisocyanate composition (B) including a polyisocyanate compound (B1), in which the polyester polyol (A1) is a reaction product of a composition including a polycarboxylic acid and ...