US Patent Issued to DEXERIALS on Oct. 28 for "Adhesive composition, thermosetting adhesive sheet, and printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,454,634, issued on Oct. 28, was assigned to DEXERIALS Corp. (Shimotsuke, Japan).

"Adhesive composition, thermosetting adhesive sheet, and printed wiring board" was invented by Jun Yamamoto (Shimotsuke, Japan), Akira Suzuki (Shimotsuke, Japan), Toshiyuki Minegishi (Shimotsuke, Japan) and Kazuhiro Date (Shimotsuke, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An adhesive composition having a low dielectric constant, low dielectric loss tangent, excellent folding endurance, and excellent heat resistance. The adhesive composition includes: with respect to the total of 100 parts by mass of the adhesive composition, 70 to 90 parts by mass of the styre...