ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,521,772, issued on Jan. 13, was assigned to DEVICE Co. LTD. (Chungcheongnam-do, South Korea).
"Substrate treatment apparatus having heating part" was invented by Taek Youb Lee (Cheonan-si, South Korea) and Hee Won Lee (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a substrate treatment apparatus having a heating part, including: a chuck base disposed rotatable around a rotational axis and having a ring-shaped spin chuck with chuck pins to support a substrate and a chuck support part located on lower portion of the inner peripheral surface of the spin chuck; a back nozzle assembly mounted at the ...