ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,027, issued on Dec. 23, was assigned to DEVICE Co. LTD. (Chungcheongnam-do, South Korea).
"Substrate treatment apparatus having heating part" was invented by Taek Youb Lee (Cheonan-si, South Korea) and Hee Won Lee (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a substrate treatment apparatus including: a chuck base having a ring-shaped spin chuck with chuck pins disposed on top thereof to support a substrate and a chuck support part located on the lower portion of the inner peripheral surface of the spin chuck; a back nozzle assembly mounted through a hollow portion formed at the center of t...