ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,502,684, issued on Dec. 23, was assigned to DEVICE Co. LTD. (Chungcheongnam-do, South Korea).
"Substrate treatment apparatus having heating part" was invented by Taek Youb Lee (Cheonan-si, South Korea), Jun Hwan Lee (Cheonan-si, South Korea) and Man Je Bang (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a substrate treatment apparatus including: a chuck base connected to a driving shaft in such a way as to be rotatable together with the driving shaft and having a spin chuck with chuck pins disposed on top thereof to support a substrate and a chuck support part; a fluid supply unit for supplying ...