US Patent Issued to DENSO on Nov. 18 for "Semiconductor device and semiconductor module" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,163, issued on Nov. 18, was assigned to DENSO Corp. (Kariya, Japan).

"Semiconductor device and semiconductor module" was invented by Takahiro Nakano (Kariya, Japan), Seigo Oosawa (Kariya, Japan), Yasushi Ookura (Kariya, Japan), Naohito Mizuno (Kariya, Japan) and Yoshihiro Inutsuka (Kariya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor element, a sealing member, and a rewiring layer. The rewiring layer includes an insulating layer covering a front surface of the semiconductor element and a part of the sealing member, an electrode connected to the semiconductor element, and an externally-exposed l...