US Patent Issued to DENSO on Nov. 18 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,172, issued on Nov. 18, was assigned to DENSO Corp. (Kariya, Japan).

"Semiconductor device" was invented by Syunsuke Arai (Kariya, Japan), Masayoshi Nishihata (Kariya, Japan), Shinji Hiramitsu (Kariya, Japan) and Noriyuki Kakimoto (Kariya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a joint part in which a first conducting part and a second conducting part are joined by a joint material. The first conducting part has a high wettability region and a low wettability region in a surface opposite to the second conducting part. The low wettability region is adjacent to the high wettability region to define an outer per...