US Patent Issued to DENSO on May 27 for "Semiconductor device having wire pieces in bonding member" (Japanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,825, issued on May 27, was assigned to DENSO Corp. (Kariya, Japan).

"Semiconductor device having wire pieces in bonding member" was invented by Daisuke Fukuoka (Kariya, Japan), Tomomi Okumura (Kariya, Japan), Yuuji Ootani (Kariya, Japan), Wataru Kobayashi (Kariya, Japan), Takumi Nomura (Kariya, Japan), Tomoaki Mitsunaga (Kariya, Japan), Takahiro Hirano (Kariya, Japan), Takamichi Sakai (Kariya, Japan) and Kengo Oka (Kariya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a semiconductor device, a semiconductor element has a front electrode and a back electrode. The back electrode is connected to a wiring member through a bonding member. Wire ...