US Patent Issued to DENSO on June 17 for "Semiconductor module with improved inspectability of stacked semiconductor elements" (Japanese Inventor)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,418, issued on June 17, was assigned to DENSO Corp. (Kariya, Japan).

"Semiconductor module with improved inspectability of stacked semiconductor elements" was invented by Syuhei Miyachi (Kariya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes: two semiconductor elements stacked in a vertical direction to overlap at least a part of the semiconductor elements; a conductive member stacked on the semiconductor elements and electrically connected to at least one of the semiconductor elements; and a resin mold integrally sealing the semiconductor elements and the conductive member. A lower semiconductor element has at ...