US Patent Issued to DENSO on June 17 for "Method of manufacturing semiconductor wafers" (Japanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,330,340, issued on June 17, was assigned to DENSO Corp. (Kariya, Japan).

"Method of manufacturing semiconductor wafers" was invented by Sodai Nomura (Kariya, Japan), Tomoki Kawazu (Kariya, Japan), Bahman Soltani (Kariya, Japan), Yutaro Isshiki (Kariya, Japan), Nobuyuki Nunome (Kariya, Japan), Shiro Okita (Kariya, Japan) and Riku Onishi (Kariya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of semiconductor wafers includes preparing a ingot having a first major surface and a second major surface in a back side of the first major surface, a peeling layer being formed in the ingot along the first major surface; and applying a ...