ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,937, issued on July 8, was assigned to DENSO Corp. (Kariya, Japan).
"Semiconductor device and production method thereof" was invented by Takao Kasai (Kariya, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor package equipped with a plurality of electrodes and a mount member which is equipped with a plurality of lands and on which the semiconductor package is mounted. The semiconductor package has the electrodes joined to the lands through solders. One of the electrodes is designed as a position/orientation control electrode for the semiconductor package. One of the lands is designed as a position/ori...