US Patent Issued to DENSO on July 8 for "Element forming wafer and method for manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,875, issued on July 8, was assigned to DENSO Corp. (Kariya, Japan).

"Element forming wafer and method for manufacturing the same" was invented by Akihiko Teshigahara (Kariya, Japan) and Megumi Suzuki (Kariya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing an element forming wafer includes the steps of: forming a thin layer on a semiconductor wafer having a plurality of chip forming regions; and adjusting stress generated in an element forming portion of the thin layer to have a specified value. The thin layer constitutes an element in each of the plurality of chip forming regions. The step of adjusting the stress incl...