ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,083, issued on July 22, was assigned to DENSO Corp. (Kariya, Japan).
"Semiconductor device" was invented by Hiroshi Ukegawa (Toyota, Japan), Takanori Kawashima (Toyota, Japan) and Akinori Sakakibara (Toyota, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The semiconductor device includes a semiconductor module and a cooler. The semiconductor module includes an insulator substrate, an inner conductor film disposed on a first surface of the insulator substrate, a semiconductor element connected to the inner conductor film, a sealing body sealing the inner conductor film and the semiconductor element, and an outer conductor film disposed on a sec...