US Patent Issued to DENSO on Dec. 9 for "Semiconductor module with non-common wiring electrode and common wiring region" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,416, issued on Dec. 9, was assigned to DENSO Corp. (Kariya, Japan).

"Semiconductor module with non-common wiring electrode and common wiring region" was invented by Syuhei Miyachi (Kariya, Japan), Toshihiro Fujita (Kariya, Japan), Atsushi Saitou (Kariya, Japan) and Noboru Nagase (Kariya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes: semiconductor elements having a gate electrode, a first electrode and a second electrode; a resin mold; and conductive members connected to at least one of the semiconductor elements and having a common wiring electrode exposed from the resin mold and connected to the first electrod...